COB Bonding

Chip-on-Board Bonding for Advanced Electronics Packaging

Service Overview

Our COB bonding capability supports chip-level packaging requirements through die bonding, wire bonding, encapsulation and laser cleaning for compact electronic assemblies.

Equipment and Capacity

Item / EquipmentDetails
Die BondingEagle Eye E-B550H, E-FM30L, E-G760
Wire BondingASM AB589, AB550
EncapsulationCOB-301
Laser CleaningSB-L661
CapabilityChip-Level Packaging Support

Manufacturing Process

Requirement and Design Review

Die Attach

Wire Bonding

Encapsulation

Laser Cleaning and Inspection

Testing and Delivery

Quality Assurance

Chip alignment, wire bonding quality and encapsulation coverage are verified before functional testing and delivery.

Applications

  • 3D SPI and AOI In-Process Inspection
  • X-Ray Inspection for Advanced Packaging
  • ERP / MES Full Traceability
  • 30+ Testing Instruments for Reliable PCBA
memory, ram, computer, technology, electronics, electronic, chip, module, circuit, board, chips, ddr3, data, digital, hardware, brown computer, brown laptop, brown data, brown memory, ram, ram, ram, ram, ram, ddr3

Compact Electronic Modules

Modern wireless earbuds in an open black charging case on a matte surface.

Audio and Consumer Electronics

A detailed close-up of computer RAM sticks and PCI cards arranged on a white surface for tech illustration.

Sensor Modules

Detailed view of electronic components on a circuit board for computer technology.

Communication Modules

Detailed view of medical equipment used in healthcare technology.

Medical Device Electronics

Let’s Discuss Your Project

Request a Quote

Send us your project requirements and we will reply within 1-2 business days.